微量添加In对铜基块体非晶合金在3.5% NaCl溶液中耐蚀性的影响(英文)

Influence of Minor Addition of In on Corrosion Resistance of Cu-Based Bulk Metallic Glasses in 3.5% NaCl Solution

研究了铜基块体非晶合金Cu55-x Zr37Ti8Inx(x=0～5,at%)及Cu61-x Zr34Ti5Inx(x=0～3,at%)在质量分数3.5%NaCl溶液中的耐蚀性。极化曲线结果表明,在铜基非晶合金中添加In元素能明显提高合金的腐蚀电位、降低腐蚀电流密度,即能明显提高耐蚀性。含In的铜基块体非晶合金的腐蚀电流密度(Icorr)值比不含In的铜基块体非晶合金低约1个数量级。而且,利用In适量取代Cu可进一步提高耐蚀性。但过量添加In不利于形成富Zr保护膜,从而降低合金的耐蚀性。

The corrosion resistances of bulk metallic glasses （BMGs） Cuss-xZr37Tislnx （x=0-5, at%） and Cu61-xZr34TisInx （x=0-3, at%） were investigated in 3.5 wt% NaC1 aqueous solution. The electrochemical potentiodynamic polarization curves demonstrate that the addition of indium to copper-based BMGs can significantly enhance the corrosion potential and reduce the corrosion current density, i.e. greatly improves the corrosion resistance. And the value of Icorr for copper-based BMGs added with indium is lower than those without indium addition, by roughly one order of magnitude. The moderate replacement of copper by indium improves the corrosion resistance further. While the excessive addition of indium reduces the corrosion resistance, resulting from the lack of Zr-rich protec- tive surface film.