电子设备散热器热传导的三维数值模拟及结构优化

Dimensional numerical simulation of heat transfer and structural optimization of electronic equipment radiator

借助ANASYS软件对热解石墨(TPG)/胶层/Al三明治结构在温度作用下Mises等效应力的分布进行了数值模拟,并通过改变TPG层、胶层、Al板的厚度实现结构优化。结果表明:不论是Al层,还是TPG层或胶层,最大拉应力区域均出现在边缘拐角处,距离边缘拐角较远的区域表现较小的应力;边缘拐角处在加载温度后最易受损,实际工艺设计时尽量使边缘拐角钝化,缓解应力集中;Al层、TPG层、胶层厚度依次为0.3,3.9,0.3 mm,三明治夹层结构的热应力分布比较合理。

The Mises equivalent stress distribution of thermal pyrolytic graphite （TPG）/adhesive layer/A1 sandwich structure under temperature loads was simulated with assistance of ANASYS software and the structural optimization was achieved owing to alterations oftbe thicknesses of AI, TPG and adhesive. The results show that the maximum tensile stress arises at the comer of the edge area and the minimum stress appeares far from the comer whether for AI layer, TPG or adhesive layer. The comer of edge area is the most damage position under temperature load and thus the comer should be passivation treatment as much as possible to relieve the stress concentration in actual design process. The thermal stress of the sandwich structure is well distributed as the thicknesses of Al layer, TPG and adhesive layer are 0.3, 3.9, 0.3 mm, respectively.