摘要
根据能量最小原理建立SMT焊点形态预测的三维数学模型 ,模拟了焊点桥接成形过程并对模拟结果进行实验验证。通过分析模拟结果 ,对SMT焊点钎料桥接机理进行理论研究。
A three-dimensional model to predict the shape of solder in SMT is created based on the minimum energy principle.The formation process of solder bridge is simulated and the results are experimentally testified.The mechanism of the solder bridge is studied according to the analysis of the simulation results.
出处
《电子工艺技术》
2001年第1期10-12,共3页
Electronics Process Technology
基金
国防热加工重点实验室基金!资助项目 (No .98JS6 1.6 .1ZS6 10 7)
