摘要
用化学腐蚀方法织构多晶硅片表面,通过调整制程参数获得腐蚀温度分别为12℃、17℃、22℃、29℃的4组样品,利用扫描电子显微镜(SEM)分析化学腐蚀后多晶硅片表面状态,通过反射谱的测试,分析了多晶硅片表面陷光效果,研究腐蚀温度与后续各制程参数的关系。结果表明:随着腐蚀温度的升高,绒面反射率、镀膜膜厚逐渐升高,开路电压、填充因子逐渐增大,短路电流逐渐减小,最终确定了最佳的腐蚀温度。
The polycrystalline silicon wafer was etched by chemical method.Four groups of cells were created with different etch temperatures of 12 ℃,17 ℃,22 ℃,29 ℃.The polycrystalline silicon surface was analyzed by scanning electron microscope (SEM) and the light trapping of the wafer surface by reflection spectrum.It was found that the etch temperature had a notable effect on the subsequent various process parameters.The results indicate that with the etch temperature increased,the antireflective film deposition thickness and the texture reflectance were seen to increase.However,the open-circuit voltage (Uoc),fill factor (FF) were also increased,and short-circuit current (Isc) was reduced.At last,the best etch temperature was determined.
基金
国家高技术研究发展计划(863计划)(2012AA050304)
太阳能光伏发电技术国家重点实验室建设项目(10963922D)
关键词
多晶硅
酸溶液腐蚀
表面织构化
腐蚀温度
电性能参数
multi-crystalline silicon
acid etching
texturization
etch temperature
electrical properties