热风返修台拆除QFP和FP及3D类器件工艺研究

Study on QFP, FP, 3D Removing Process with Hot Air Rework Station

热风返修台采用非接触热风对流热传递方式,加热系统包括底部加热、顶部加热和局部加热,适于表贴器件返修;目前,QFP、FP和3D类器件返修多采用热风枪加热,待引腿焊点融化后,将器件取下,手工焊接替换器件。使用热风枪加热拆除器件效率低,热量不易控制。通过探索,适当的工艺条件下,热风返修台可以高效拆除QFP、FP和3D类表贴器件,同时不会对周围器件、焊盘及印制板造成损伤。

Hot air rework station has bottom heater, top heater and local heater, adopts non-contact hot air convection to heat, and repair Surface Mounted Device （SMD）. The hot air gun was mostly used to melt the soldering joint of QFP, FP and 3D which will be repaired, and then the device was replaced manually, this way is inefficiency and uncontrollable. Hot air reworkstation can remove QFP, FP and 3D efficiently with proper parametersand will not damage the nearby component, pad and PCB.