摘要
无铅波峰焊接工艺是常见组装焊接工艺之一,其中焊接空洞是较严重的问题。焊接空洞的存在是电子学产品的潜在隐患,影响产线补板效率,增加生产成本。以实际生产过程中混装电路板过波峰焊时遇到的通孔焊接空洞现象进行分析,主要从印制板制程工艺与波峰焊工艺参数这两方面提出解决方案。
Lead-free wave soldering technology is one of the common assembly technology but in which solder void is a serious problem. Solder void is potential risk of electronic product, influences efficiency of production line, increases the cost of production. Analyze solder void phenomena of the mixed PCB soldering based on the actual production process, put forward solutions from printed circuit board process techno Iogy and process parameters of wave soldering.
出处
《电子工艺技术》
2014年第1期45-48,62,共5页
Electronics Process Technology
关键词
无铅波峰焊
通孔
焊接空洞
Lead-free wave soldering
Through hole
Solder void
