摘要
针对实现大尺寸界面完全贴合,完成固/固扩散焊结合的工程实际问题,通过添加同质软金属TA1实现Ti6Al4V的扩散连接,同时对比研究了不添加中间层的Ti6Al4V扩散焊。运用OM,SEM及EDS分析了焊接界面的形貌、微观组织及成分变化,测试了接头的抗拉强度。结果表明:添加TA1中间层后,界面软硬结合利于孔洞的消失,晶界结合良好;界面处形成了5μm左右连续固溶变化的扩散层,冶金结合充分;焊件变形量1.0%,接头平均抗拉强度约为母材强度的95%,能满足工程设计的要求。
With the soft TA1 interlayer,Ti6A14V/Ti6A14 V was successfully joined by a diffusion bonding process,a large- scale tightly- attached interface was obtained,and the solid state combination engineering problems were successfully resolved.In the meanwhile,Ti6A14V/Ti6A14 V was directly bonded for comparison.OM,SEM,EDS were used to analyze the morphology,microstructure and phase variation of the bonding interface,and the bonding strength was tested.The results show that the soft TA1 interlayer is helpful for the vanishing of micro-pores,and the grain boundaries are well combined.A 5 μm continuously changing solid soludon layer is formed,and the metallurgical bonding is perfect.The deformation rate of the specimen is 1.0%,and the average tensile strength can reaeh up to 95%of the base metal,so this sound joint can satisfy the requirement of the engineering design.
出处
《焊接》
北大核心
2014年第1期22-25,69,共4页
Welding & Joining
基金
陕西省科技统筹创新工程计划项目资助(2012HBSZS021)
关键词
扩散焊
钛合金
中间层
变形量
diffusion bonding
titanium
interlayer
deformation
