摘要
结合环氧树脂固化反应动力学模型和有限元计算机仿真技术,模拟了绕组固化的温度场和固化度场,模拟结果与试验结果进行了对比。
Based on the reaction kinetic model of epoxy resin curing and the finite ele- ment model of computer, the fields of temperature and curing degree of winding curing are simulated. The simulated results are compared with the tested ones.
出处
《变压器》
北大核心
2014年第2期38-40,共3页
Transformer