电子产品包装用低残留聚丙烯酸酯压敏胶的研究进展

Research Progress on Low Residual Polyacrylate Pressure Sensitive Adhesives for Packaging of Electronic Products

电子产品保护膜用聚丙烯酸酯PSA(压敏胶)具有快速粘贴被粘物表面对其进行保护、剥离后又不污染被粘物表面的性能。影响其性能的主要因素有影响聚合物粘弹性的因素、影响PSA和被粘物界面反应的因素。本文综述了近年来各种改性方法包括反应型乳化剂改性、增粘树脂、新的聚合方法改性、交联改性、有机硅改性等研究进展。对开发功能性的、多样化的适用型环保PSA,提高PSA的再剥离性能,减少涂胶量和再剥离时的残胶量,实现高剪切强度、高剥离强度、高粘性的PSA的商品化等发展方向进行了展望。

Pressure sensitive adhesives for electronic products packaging have the properties that can adhere strongly to solid surfaces to protect them without polluting them when peelling off. The performance depends on two main factors： viscoelastic behavior and interfacial interaction between PSA and substrate. Modifying methods, including polymeric emulsifiers modification, tackifying resins, new polymerization technics, cross-linking agent and silicone modification are reviewed in this paper. A look to the future development, including environment-friendly PSA with multifunctional characteristics to improve the re-peeling properties, glue amount reducing, repelling residue reducing, high shear strength, high peel strength and high tack, is also discussed.