CMOS集成电路的电热耦合效应及其模拟研究

A Simulation and Study of Electro-Thermal Coupling Effects in CMOS IC's

文章基于集成电路具体的封装结构提出了它的热学分析模型。针对均匀温度分布的集成电路 ,采用解耦法实现了电热耦合模拟软件 Etsim。

WT5”BZ]A thermal analysis model for a packaged IC chip is proposed and the temperature-dependent circuit performance is analyzed Based on relaxation method, an electro-thermal simulator (Etsim) has been developed, which can be used to simulate the electro-thermal effects under uniform temperature distribution