重掺杂型混合信号集成电路衬底的噪声模型研究

Modeling of Heavily Doped Substrate Crosstalk in Mixed-Signal IC′s

应用器件模拟软件 SILVACO模拟三种结构重掺杂型衬底中注入高频电流的分布 ,根据模拟结果分析得出重掺杂型衬底的简化模型为一单节点 ,进而将简化模型与实际的混合信号集成电路结合 ,建立起重掺杂型衬底的噪声模型 。

The vector paths of the current injected into the heavily doped substrate with three different structures are simulated using device simulator SILVACO The simulation results indicate that the whole substrate can be modeled as a single node With this simplified model incorporated in the actual mixed-signal IC's and depending on the circuit layout, the total substrate crosstalk model of the heavily doped substrate is extracted The parameter extraction is also derived