一种新的SOI技术──智能切割

A new SOI technology: smart-cut

智能切割是一种应用于ＳＯＩ的新技术，它的最大特点是能高效地利用原材料，大幅度降低成本。本文综述了硅片键合原理和智能切割的工艺原理、优点及其影响因素。

Smart-cut is a new technology for SOI with a salient advantage in using materials efficiently, and can lower the cost dramatically. This paper is a review on smart-cut, its principle, advantage and the affecting factors.