FPGA工作温升与运行程序的关系

Relation of FPGA Working Temperature Rise and the Program

现场可编程门阵列(FPGA)的低成本和高度灵活性,使其在嵌入式系统中占据了重要的地位。FPGA的工作温升与运行程序有很强的依赖关系。主要研究了时钟频率和资源利用率两个方面对FPGA工作温升的影响,分别利用红外热像仪和K型热电偶测量了FPGA在真空和大气中的工作温升。采用锁相环(PLL)进行倍频产生8组输出频率进行时钟测量。资源利用率主要通过控制逻辑单元的数目来实现。最后采用阿尔特拉(Altera)公司的Power Play EPE软件对FPGA在不同情况下的功耗进行了估算。通过对实验结果的分析和比较,发现随着时钟频率增加,FPGA表面温度不断增大;随着资源利用率(逻辑单元数目)的增加,温度也随之增长。通过EPE软件估算出功耗与时钟频率、逻辑单元的数目均成正比例关系。

Field programmable gate array （FPGA） plays a vital role in the embedded system on account of its low cost and high flexibility. The working temperature of the FPGA is dependent on the program. In the experiments, the clock frequency and the utilization rate of resources are considered as the important factors, which critically effect the FPGA working temperature rise. FPGA working temperature rise on vacuum and in the atmosphere was measured using the infrared imager and K-type thermocouple, respectively. The phase locked loop （PLL） for the frequency was used to generate eight sets of the output frequency. The utilization rate of resources has the been controlled by the number of logic elements. Finally, the power consumption of the FPGA in different cases was estimated based on Altera Power Play EPE software. By analyzing and comparing the experimental data, the results show that the surface tem- perature of FPGA rises with the increase of clock frequency and utilization rate of resources （ the number of logical element）. The EPE software simulation results show that the power consumption linearly increases with the clock frequency and logical element number, respectively.