摘要探讨了铜与氧的反应 ,提出了铜与氧的反应产物除有CuO外 ,还应有Cu2 O的观点 .This essay attempts to demonstrate the idea that,besides CuO,Cu 2O results from the copper and oxygen reaction.
3Sun Y S, Driscoll J C. A new hybrid power technique utilizing a direct copper to ceramic bond[J]. IEEE Trans. Electro. Devices,1976, 23(8):961-967
4Burgess J F; Neugebauer CA; Flanagan G; et al. Hybrid packages by the direct bonded copper process[J]. Solid State Technol. 1975,18(5) :42-44
5Burgess J F, Neugebauer C A, Flanagan G, et al. The direct bonding of metals to ceramics and application in electronics [J]. ElectroComponent Science and Technology, 1976, 2(4) :233-240
6Dickson J F. Direct Bond Copper Technology: materials, methods, applications[J]. Int. J. Hybrid Microelectron, 1982, 5 (2) :103-109
7Newton P, Strassheim P. Power hybrids developments in packaging technology[J]. IEE Review, 1989, 35(4) :149-151
8Jurgen Schulz-Harder etal. Advantages and new development of direct bonded copper substrates[J]. Microselectronics Reliability ,43(2003) :359-365
9M. Entezarian,R. A. L. Drew. Direct bonding of copper to aluminum nitride[J]. Matericals Science and Engineering , A212 (1996)206-212
10H. He,etal. ,A new method for preparation of direct bonding copper substrate on Al2O3Mater. Lett. (2007),doi: 10. 1016/ j. matlet. 2007.01. 036
