采用板级散热设计降低基站电源的成本

PCB Level Thermal Design to Reduce BS Power Supply Cost

采用板级散热设计是充分发挥PCB本身潜在的散热能力,并通过优化PCB的设计强化PCB的散热性能,减小对强迫风冷的风速要求,并且使得部分产品的自然散热成为可能,以降低成本,同时满足产品的可靠性要求。文中给出了板级散热设计的对象、途径、及其成本上的优势,最后以AC-DC基站电源为例,介绍了低成本的板级散热设计在基站电源中的应用。

The aim of PCB level thermal design is to fully develop PCB potential cooling capacity, optimize PCB placement and PCB Layout to improve natural cooling, and make it feasible for system design without 1an. For some products, make PCB nature cooling applicable will not only meet system thennal requirement, but also highly reduce system cost.The arctical has submitted the PCB level design object, approach and the cost advantage and introduced the application of the low cost PCB level thermal design in the field of BS power supply using the AC-DC BS power supply as an example.