PANI/N-K_2Ti_4O_9/UiO-66复合材料的制备及光催化性能研究

Preparation and photocatalytic properties of PANI / N-K_2Ti_4O_9 / UiO-66 composites

用自组装法将金属有机框架UiO-66负载到低带隙半导体N-K2Ti4O9的表面,然后采用原位氧化复合法制备导电聚合物聚苯胺粘结的PANI/N-K2Ti4O9/UiO-66复合光催化剂(复合材料A),制备了N-K2Ti4O9和UiO-66不同比例物理混合后再粘结聚苯胺的复合材料B。采用红外(IR)、场发射透射电镜(FETEM)、荧光光谱(PL)对复合材料的结构、形貌进行表征。结果表明,UiO-66负载到棒状N-K2Ti4O9的表面呈现核壳结构,聚苯胺(PANI)粘结在核壳结构N-K2Ti4O9/UiO-66的表面形成复合材料,PANI粘结可以有效降低电子-空穴复合率,复合材料A具有最好的光催化性能。

Using self-assembly route, a Zr-based metal-organic framework UIO-66 was loaded onto the surface of a low band-gap semiconductor, N-K2Ti4O9, and then composite photocatalysts of PANI/N- K2Ti4O9/UiO-66（composite A） where polyaniline （PANI） acts as adhesion agent were prepared by insitu oxidization polymerization, and the ratio of components was optimized. N-K2Ti4O9 and UIO-66 were prepared separately,and mixed to act as physical mixtures,which were wrapped by PANI and denominated composite B. The composite photocatalysts were characterized structurally and morphologically by IR, FETEM and PL spectra. The results showed that UiO-66 was loaded onto the surface of N-K2Ti4O9 to form a core-shell structure,which structure bonded composite material formed on the surface of N-K2Ti4O9/ UIO-66. PANI Wrapping is beneficial to reduce the electron hole recombination rate and composite A exhibits much better photocatalytic performance.