室温固化耐温200℃环氧树脂胶粘剂的研制

Study on preparing room temperature curable EP adhesive with high temperature(200℃) resistance

以高活性EP(环氧树脂)[即AFG-90(缩水甘油胺型EP)]为基体树脂、耐热的多官能度BTDA(3,3′,4,4′-二苯甲酮四酸二酐)为固化剂和ME-1为叔胺类促进剂,制备了一种室温固化型耐高温EP胶粘剂。采用差示扫描量热(DSC)法、凝胶试验和热失重分析(TGA)法研究了该胶粘剂的固化反应特性和热性能,并探讨了a∶e[即n(酸酐基团)∶n(环氧基团)]比值、促进剂含量等对该胶粘剂性能的影响。研究结果表明:该胶粘剂具有良好的耐高温性能,并且可室温固化,其25℃时的凝胶时间为80 min,失重5%时的温度为311℃;当a∶e=0.80∶1、w(ME-1)=1.0%(相对于EP质量而言)时,该胶粘剂的综合性能相对最好,其室温、200℃时的拉伸剪切强度(钢-钢)分别为21.86、18.55 MPa。

With high-activity EP （epoxy resin）[namely AFG-90 （glycidyl amine type-EP）] as matrix resin, heat- resistant polyfunetional degrees BTDA （3, 3＇, 4, 4＇-benzophenone tetraeid dianhydride）as curing agent, ME-1 as tertiary amine promoter, a room temperature curable EP adhesive with high temperature resistance was prepared. The curing reaction characteristics and thermal properties of the adhesive were investigated by DSC （differential scanning calorimetry）, gelation test and TGA （thermogravimetic analysis）methods. And the influences of a： e[namely molar ratio of n （anhydride group） ：n（epoxy group）] value, and promoter contents on the properties of adhesive were discussed. The research results showed that the adhesive, which could be cured at room temperature, had good high temperature resistance, its gelation time was 80 min at 25℃, and its temperature at 5% weight loss was 311 ℃. The adhesive had the relatively best combination property because its tensile shear strengths （steel-steel）were 21.86 MPa at room temperature and 18.55 MPa at 200 ℃ when a：e value was 0.80： 1, and mass fraction of ME-1 was 1.0% in EP.