摘要
采用SerDes作为物理层来实现背板互联,使各个插接到背板上的单元板通过千兆以太网协议互联起来。简要介绍了系统的基本架构和互联方式后,运用Altera公司的CycloneIV芯片实现的千兆以太网接口通过SerDes与Broadcom公司的千兆以太网交换芯片互联。最后给出了该设计的测试结果和结论。
The backplaneg interconnection is achieved by using SerDes as the PHYsical layer so that each unit isplugged into the backplane board interconnects by Gigabit Ethernet protocol. This paper describes the basic architecture and interconnection method. The interface of Gigabit Ethernet is realized by using the chip of cycloneIV from Altera and is interconnected with Broadcom＇s Gigabit Ethernet switch chip via SerDes. The test results and conclusions of the design are completely given in the paper.
出处
《微处理机》
2014年第1期32-34,共3页
Microprocessors
