摘要
对比了酚醛胺NX-2003D及聚酰胺Versamid140与环氧树脂Epon828胶粘剂的力学强度,及在室温、低温、潮湿面的粘接强度。通过设计的建筑胶配方,研究了其室温及低温的粘接强度增长速度,及耐湿热老化性能。结果表明,在常温固化时,NX-2003D体系具有与Versamid140体系相近的良好力学强度及粘接性能;但在低温条件下,NX-2003D体系表现出优于聚酰胺140体系的固化性能,在0℃固化7 d及14 d后,NX-2003D体系的拉伸剪切强度分别达到5 MPa及11 MPa以上,可以满足使用要求。NX-2003D体系的耐湿热老化性能及对潮湿面的粘接强度,也明显优于聚酰胺140体系。
The mechanical strength and lap shear strength （LSS） of Epon828 based adhesives cured with phenalkamine NX-2003D and polyamide Versamid 140 at different curing conditions were compared. And their LSS development at room and low temperature and hot water aging performance were investigated. The results showed that the NX-2003D system had similar good mechanical strength and bonding strength as the Versamid 140 system at room temperature, but exhibited much better LSS development at low temperature and on wet surface than that of latter. After 7 d and 14 d at 0℃, the LSS of NX-2003D system could reach to 5 MPa and 11 MPa, respectively. The good mechanical properties developed at low temperature coupled with excellent wet surface adhesion had made NX-2003D a good choice to meet the requirements of primary and final bonding strength even at formidable conditions.
出处
《粘接》
CAS
2014年第2期57-60,共4页
Adhesion
