电铸技术及其应用

Electroplate Method and Its Applications

本文收集了大量资料,用来详述铜、银、镍及镍-钴合金、高速电铸技术及其应用。指出了影响这些电铸层性能的5种因素,即电流密度、电铸温度、pH值、杂质离子及电铸层的热处理温度,同时还论述了电铸液的管理方法。介绍了电铸技术在制造模具领域、箔及薄带生产、网板及网眼生产、印刷板的制作、电视录像盘的制作、软件印刷基板、集光镜面的制作及高精零件的复制方面的应用。着重阐述了电铸技术关键之一的脱模技术。

Large data and informations hare been collected to recount the high-speed electroplate method used for Cu, Ag, Ni, and NiCo alloy and thier applications. The five factors (electric current density, electro plate temperature,PH,foreign ion and heattreated temperature) which can change the properties of the electroplate layers have been pointed out. The applications of electroplate (prepearing die set, foil and printed circuit etc.) have also been introduced and the demould method has been summarized.