半陶瓷步距规热膨胀系数的研究

Research on Thermal Expansion Coefficient of Semi- ceramic Step Gauge

将一个新购Omm-500mm的0级半陶瓷步距规，随自然温度条件下的热膨胀量，进行了大量的检测研究，发现步距规随温度的变化其长度尺寸，与量块的长度变化量有很大差值，会在不同的温度下产生蠕变。在偏离标准温度20℃的情况下，会产生很大的测量误差．文章通过步距规和量块在不同温度下的变化规律，为精密机床的，／装配和检测提供了依据。

In this paper, the thermal expansion in natural ramic step gauge was detected and studied and the result temperature of a new 0 mm -500mm level 0 semi - ce- shows that the step gauge length change varies with the temperature and has big difference with the length change of gage blocks, creep was brought under different temper- ature. The obvious measurement error will occur in the deviation from the standard temperature of 20℃. Through studing the change regularity under different temperature, this paper provides rationale for assembling and detecting of precision machine tool.