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Effects of rapid thermal annealing on ohmic contact of AlGaN/GaN HEMTs 被引量:1

Effects of rapid thermal annealing on ohmic contact of AlGaN/GaN HEMTs
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摘要 Ohmic contacts with Ti/Al/Ti/Au source and drain electrodes on A1GaN/GaN high electron mobility transistors (HEMTs) were fabricated and subjected to rapid thermal annealing (RTA) in flowing N2. The wafer was divided into 5 parts and three of them were annealed for 30 s at 700, 750, and 800 ℃, respectively, the others were annealed at 750 ℃ for 25 and 40 s. Due to the RTA, a change from Schottky contact to Ohmic contact has been obtained between the electrode layer and the A1GaN/GaN heterojunction layer. We have achieved a low specific contact resistance of 7.41 × 10-6Ω cm2 and contact resistance of 0.54 Ω.mm measured by transmission line mode (TLM), and good surface morphology and edge acuity are also desirable by annealing at 750 ℃ for 30 s. The experiments also indicate that the performance of ohmic contact is first improved, then it reaches a peak, finally degrading with annealing temperature or annealing time rising. Ohmic contacts with Ti/Al/Ti/Au source and drain electrodes on A1GaN/GaN high electron mobility transistors (HEMTs) were fabricated and subjected to rapid thermal annealing (RTA) in flowing N2. The wafer was divided into 5 parts and three of them were annealed for 30 s at 700, 750, and 800 ℃, respectively, the others were annealed at 750 ℃ for 25 and 40 s. Due to the RTA, a change from Schottky contact to Ohmic contact has been obtained between the electrode layer and the A1GaN/GaN heterojunction layer. We have achieved a low specific contact resistance of 7.41 × 10-6Ω cm2 and contact resistance of 0.54 Ω.mm measured by transmission line mode (TLM), and good surface morphology and edge acuity are also desirable by annealing at 750 ℃ for 30 s. The experiments also indicate that the performance of ohmic contact is first improved, then it reaches a peak, finally degrading with annealing temperature or annealing time rising.
出处 《Journal of Semiconductors》 EI CAS CSCD 2014年第2期147-150,共4页 半导体学报(英文版)
基金 Project supported by the National Natural Science Foundation of China(No.61107026) the Scientific Research Fund Project of Municipal Education Commission of Beijing(No.KM201210005004)
关键词 AlGaN/GaN HEMT RTA ohmic contact AlGaN/GaN HEMT RTA ohmic contact
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