摘要
对黄铜进行酸性镀铜后再采用氟硅烷-乙醇溶液进行化学修饰得到超疏水表面。通过正交试验得到电镀铜的最佳工艺条件为:CuSO_4.5H_2O 0.5 mol/L浓硫酸6.5%(体积分数),电流密度0.12 A/cm^2,温度26℃,极板间距5cm,电镀时间20min。在该工艺下电镀铜再化学修饰后,所得表面静态接触角和滚动角分别为157°和4°,表面分布有大量直径约2.5μm的球状凸起,球状凸起之间分布有柱状凸起和凹坑。初步研究了镀层发白现象与电镀工艺条件和超疏水表面疏水性之间的关系,为电沉积制备合金基底的超疏水表面和黄铜超疏水表面用于工业生产提供一定的理论和技术参考。
Superhydrophobic surface on brass substrate was obtained by acid copper plating followed by chemical modification using fluorosilane-ethanol solution. The optimal process conditions obtained by orthogonal test are as follows: CuSO4'5H20 0,5 mol/L, concentrated sulfuric acid 6.5vo1%, current density 0.12 A/cm2, temperature 26 ℃, distance between anode and cathode 5 cm, and plating time 20 min. After plating under the given conditions and chemical modification, the static contact angle and rolling angle of brass surface are 157° and 4°, respectively. Abundant spherical protuberances with a diameter of about 2.5 pm are distributed on the brass surface, and there are columnar protuberances and recess between different spherical protuberances. The relationship between the whitening phenomenon of coatings and plating conditions and the hydrophobicity of superhydrophobic surface was preliminarily studied, which provides some theoretical and technological reference for the preparation of superhydrophobic alloy surface by electrodeposition, and for the industrial application of superhydrophobic brass surface.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第4期137-141,共5页
Electroplating & Finishing
基金
深圳市科技研发基金项目(ZDSY20120616140826670)
关键词
黄铜
酸性镀铜
超疏水
氟硅烷
化学修饰
brass
acidic copper plating
superhydrophobicity
fluorosilane
chemical modification