电镀镍中间体对酸性化学镀镍的影响研究

Study on effects of nickel electroplating intermediates on acidic electroless nickel plating

在由26.8g/L NiSO_4.6H_2O、150 mL/L BH-320B和30mg/L稳定剂组成的酸性化学镀镍液中,研究了电镀镍用中间体ATQM、SSO3、MPA和DEP对沉积速率、镀层性能和镀液稳定性的影响。结果表明,ATQM和SSO3可作为化学镀镍液的促进剂,MPA和DEP可用作化学镀镍液的光亮剂。此外,MPA和SSO3还对化学镀镍液起辅助稳定剂的作用。镀液中不同添加剂的存在对镀层结构无明显影响,所得镀层均为非晶态结构。

The effects of nickel electroplating intermediates including ATQM, SSO3, MAP, and DEP on the deposition rate, coating performances, and bath stability of electroless nickel plating in an acidic bath consisting of NiSO4＇6H20 26.8 g/L, BH-320B 150 mL/L, and stabilizer 30 mg/L were studied. It was found that ATQM and SSO3 can be used as accelerators in electroless nickel plating, while MPA and DEP can be used as brighteners. MPA and SSO3 play a part of auxiliary stabilizer in electroless nickel plating bath. The existence of different additives in electroless nickel plating bath has no effect on the structure of coating and all of the obtained coatings are amorphous.