银层致密性对叠层片式电感器应力的影响

Effect of silver layer compactness on multilayer chip inductors stress

针对叠层片式电感器在生产过程进行焊接性试验时出现的墓碑应力不良现象,通过扫描电镜(SEM)、等离子光谱、DPA(破坏性物理分析)等手段对产生不良现象的原因进行了分析,并对解决该问题的途径进行了探讨。结果发现叠层片式电感器端电极的三层结构中底层银层的致密性对应力的产生影响很大。通过降低烧银升温速率、提高烧银温度等措施使烧银工艺制度得到改善和优化,可提高银层的致密性,使墓碑应力不良问题得以解决,从而有效地指导生产。

The tombstone phenomenon during the welding test of the multilayer chip inductor （MLCI） production was characterized with scanning electron microscopy （SEM）, plasma spectroscopy, DPA （destructive physical analysis） and other measures, meanwhile the ways to solve this problem were disscussed. The results show that the compactness of base silver layer of the MLCI＇s trilayer termination electrode has great effect on the stress. By decreasing the heating rate and increasing the sintering temperature to improve and optimize the sintering technology of Ag electrode, the compactness of the silver layer is improved, and the tombstone phenomenon is solved, which direct the production effectively.