QFP器件激光软钎焊温度场的建模与仿真

QFP device laser soldering temperature field modeling and simulation

为了解决不同工艺参数组合下激光焊接 QFP器件后其器件的温度场分布问题,选取激光焊接有效功率、时间和光斑面积3个工艺参数,采用有限元软件 ANSYS,对特定 QFP 器件激光软钎焊温度场的分布进行模拟。仿真结果表明：激光焊接有效功率、光斑面积与焊点处的最高温度几乎为线性关系,焊接时间与焊点处的最高温度为正相关关系,且切线斜率逐渐减小；当焊接有效功率为1-4 W,焊接时间为1-2 s,光斑面积为0.03-0.11 mm2,封装体、印制板、焊点温度最高分别可达240、350、510℃。仿真结果为激光软钎焊工艺参数的预选提供参考,并为相关产品激光软钎焊的综合参数优化打下基础。

In order to solve the problem of temperature distribution of the QFP device after the laser soldering under different process parameters,three welding parameters （effective power,time,and spot area）are selected,the finite element soft-ware ANSYS is used to simulate temperature field distribution of the specific QFP device.The simulation result shows that laser welding effective power and spot area are almost linear relationship with the highest temperature of the solder joint, and that time is positive correlation in which the tangent slope decreases slowly.When the effective power is in 1-4 W,time is in 1-2 s and spot area is in 0.03-0.1 1 mm2 ,the highest temperature of plastic package,printed board and solder joint can reach 240,350,5 10 ℃.The simulation results can provide references for primary election of the laser welding technological parameter and lay a basis for the laser soldering integrated parameters optimization of relative products.