摘要
LED因其高效化、高功率化、高可靠性和低成本的不断发展,LED封装技术在越发重要的同时面临巨大的挑战。在封装过程中,封装材料和封装结构对LED散热与出光的影响最为关键。本文主要从封装材料(芯片、基板、热界面材料、荧光粉)和封装结构(Lamp、Surface Mounted Devices(SMD)、Chip on Board(CoB)、Remote Phosphor(RP))上,阐述LED封装的研究现状以及发展趋势。
With the development of efficiency, high power, high reliability and low cost, LED packaging technology becomes more important, while facing enormous challenges. In the process of packaging, materials and structures are key factors in heat dissipation and light extraction. This paper mainly described research status and development trends of LED packaging from materials （chips, substrates, thermal interface materials, phosphors） and structures （Lamp, Surface Mounted Devices （SMD）, Chip on Board （COB）, Remote phosphor （RP））.
出处
《照明工程学报》
2014年第1期26-30,共5页
China Illuminating Engineering Journal
基金
国家高技术研究发展计划(863计划)(SQ2010AA0323083001)
2013年科技部科研院所专项(2013EG111218)
2013年江苏省科技支撑(工业)计划(BE2012115)
关键词
LED
封装
材料
结构
LED
packaging
material
structure
