定向碳纳米管阵列的转移技术研究进展

Research Progress on Transfer Technique of Aligned Carbon Nanotubes

定向碳纳米管阵列具有大的长径比、优异的力学性能以及良好的导电、导热特性,在微电子封装、热界面材料、场发射器和干粘附材料研发方面具有潜在优势。单晶硅是化学气相沉积法(CVD)制备定向碳纳米管阵列最佳的基底材料,但对于定向碳纳米管阵列的应用有所限制。目前在定向碳纳米管阵列转移方法上已汇集了大量的研究工作,着重介绍了当前主要的四种转移方法 -溶液刻蚀法、焊料转移法、化学转移法、粘结剂转移法,探讨了各种方法的优缺点,分析和展望了有利于定向碳纳米管阵列在干粘附材料上应用的转移方法。

Aligned carbon nanotubes （A-CNTs） with extraordinary high aspect ratio,exceptional mechanical strength and strong electrical and thermal conductivity show great potential in the application of microelectronics package,thermal interface material,field emission display and dry adhesive materials.Silicon/quartz wafers are an ideal substrate which is used for CNTs growth by chemical vapor deposition （CVD） processing,but it restricts further applications of aligned carbon nanotubes.Recently,a few methods are developed,which are used to transfer aligned CNTs to desired substrates.This article introduces and discusses several transfer methods,such as solution etching process,solder transfer and chemical transfer et al,and proposes a proper transfer method for the gecko-inspired dry adhesive application.