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金刚石线锯技术问题探讨

Discussion on technology for fixed abrasive diamond wire saw
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摘要 探讨金刚石线锯的技术问题,包括母线的材质、规格、强度、连接方法和结构形式;金刚石磨料的粒度、某些物理特性以及金刚石磨料在母线上的电镀固着方法和树脂粘结法及其改进措施。文章还提出了有待探索研究的课题,包括复合固着法、母线精细喷砂处理、金刚石磨料表面织构化处理以及微水刀激光技术应用于晶片切割的可行性。 Technology for fixed abrasive diamond wire saw including the material, size, "strength,connection and structure of the core wire; particls size and some physical charac- teristics of the diamond abtasive, along with the electroplated fixation menthod and resinoid fixation method for diamond abrasives on the core wire and its improvement measures were discussed. The subjects that need to be discussed and studied including composite fixation method, fine sand blsting on core wire, surface texture of diamond abrasives and feasibility of the application of laser microjet in wafer slicing were suggested in this paper.
作者 谈耀麟
出处 《超硬材料工程》 CAS 2013年第4期45-48,共4页 Superhard Material Engineering
关键词 金刚石线锯 母线技术要求 金刚石磨料 固着 喷砂 表面织构化 微水刀 diamond wire saw core wire specification diamond abrasive sand blasting surface texture laser mierojet
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参考文献7

  • 1US Patent 6065462.
  • 2WIPO Patent Application Wo/2001/138129.
  • 3ww. bekaert, corn.
  • 4Suwabe Hitoshi:Thin wire tool eleetrodeposited diamond grains and high-speed slieing system,Journal of the Japan Society for Abrasive Teehuology, 2001, Vo145. NoB.
  • 5T. Enomoto. Y. Shimazaki, Y. Tani, M. Suzuki:Development of a resinoid diamoud wire containing metal powder for slicing a sili- cou iugot.
  • 6Chiba Yosuaki eta[. Development of high--speed electroplating method of a wire for slicing a silieon ingot.
  • 7US Patent App|icatton 20120017741.

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