摘要
采用真空扩散焊方法焊接铝合金。采用万能试验机测试扩散焊接接头剪切强度,采用光学显微镜对焊接接头的显微组织进行了分析,并计算了晶粒尺寸大小。结果表明,焊接接头剪切强度随焊接温度增加先增加后减小,最大值达到156 MPa。焊接温度较低时,焊接接头界面存在缝隙,随着焊接温度升高,缝隙消失,界面结合良好。界面晶粒尺寸随焊接温度增加呈增大的趋势。
The vacuum diffusion bonding was used to weld aluminium alloy. The universal testing machine was used to obtain the shear strength of the bonded joint. The microstructure of the bonded joints was studied by optical microscope. The results show that the shear strength increases firstly and then decreases with the bonding temperature increasing, and it exhibits a maximum value of 156 MPa. When the bonding temperature is low, the welding line is seen at the welded joint, and the weld line disappears with the bonding temperature increasing. The grain size grows as the bonding temperature increasing.
出处
《热加工工艺》
CSCD
北大核心
2014年第5期216-217,共2页
Hot Working Technology