摘要
由"热致失效"介绍电子设备散热的重要性及方式,通过将模型简化及热管位置的方案规划,经CFD仿真软件对各方案进行分析并对比结果,以此得出适合的最优化设计。
Based on ＂Thermally Induced Failure＂, it introduces the importance and methods of the electronic equipment＇s thermal solution. Through model simplification and heat-pipe position planning, via CFD analyzes all of the planning and compare the result to get the most optimized design that fits the practical case.
出处
《科技创新导报》
2014年第2期16-17,共2页
Science and Technology Innovation Herald
