摘要
介绍了多芯片子系统壳体的技术要求,采用不同的Al-Si复合材料加工成统一结构,进行激光焊接,并对焊件进行检漏,研究了Al-Si复合材料的特性.结果表明,随着Si元素含量增加,从Al-40Si到Al-50Si,Al-60Si复合材料,焊缝氦泄漏率逐渐增大,即焊缝密封性逐渐降低;烧结密度是影响焊缝气密性最主要的因素,随着烧结密度增大,焊缝气密性迅速提高;随着粉末粒度增大,复合材料的焊缝氦泄漏率缓慢增大,即焊缝气密性缓慢降低,用5μm粉末为原料进行热压烧结,制得Al-50Si复合材料的密度高达99.6%TD,焊缝氦泄漏率为0.98×10-9Pa·m3/s,满足了多芯片子系统壳体气密封装要求.
Technical requirements of multi-chip subsystem shell were introduced.And uniform structure with different Al-Si composite was manufactured by laser welding.leak detection was also done for these Al-Si speciments.The results indicate that He leakage rate of weld seam increases with the increase of Si contents in the composite.The main factor which effects weld seam-sealing performance is sintered density,i.e.weld seam sealing performance improves rapidly with the increase of sintered density.Meanwhile,weld seam sealing performance becomes worse with increase of powder size.The hot-pressing sintering density of Al-50Si composite is up to 99.6% TD using metal powder with 5μm size,He leakage rate of weld seam is 0.98 × 10-9Pa·m3/s,which meet the hermetic package demands of multi-chip subsystem.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2014年第2期59-62,116,共4页
Transactions of The China Welding Institution
关键词
铝硅合金
热压烧结
泄漏率
封装
Al-Si alloys
hot-pressing sintering
leakage rate
package
