期刊文献+

AlGaN/GaNHFET逆压电效应抑制技术

Reduction Technique of Inverse Piezoelectric Polarization Effect on AlGaN /GaN HFETs
下载PDF
导出
摘要 基于非对称晶体的逆压电效应(IPPE),通过自洽求解一维Poisson-Schrdinger方程,模拟了AlGaN/GaN HFET在外电场作用下沟道中2DEG浓度的变化,建立了电流崩塌效应的逆压电效应数值仿真模型。理论模拟显示:逆压电效应是引起电流崩塌效应的一个因素。根据GaN欧姆接触的机理,提出采用源漏凹槽的结构减小电场的垂直分量,抑制逆压电效应,减小饱和电流的变化。设计了不同结构的源漏凹槽结构器件,并进行工艺流片验证,得到优化的器件结构,器件的电流崩塌量从15.7%减小到8.9%,验证了理论仿真结果。 Base on the inverse piezoelectronic polarization effect (IPPE) of asymmetric crystal, the change of 2DEG concentration in AlGaN/GaN HFET under the action of electric field was simulated, and the numerical IPPE model of current collapse effect was setted up through the self-consistent solution of one-dimensional Possion-Chrodinger equation. It is found that IPPE is one of the sources of current collapse. Base on the GaN ohmic contact mechanism, the source leakage groove structure was presented to reduce the vertical component of electric field, inhibit the IPPE, and reduce the change of the saturation current. The validation process flow sheet was proved, and the optimized device structure was obtained. The current collapse parameter of the device decreases from 15. 7% to 8.9%, so simulation results verify the theory.
出处 《半导体技术》 CAS CSCD 北大核心 2014年第3期183-187,共5页 Semiconductor Technology
关键词 AlGaN GaN HFET 薛定谔方程 逆压电效应(IPPE) 源漏凹槽 电流崩塌 AlGaN/GaN HFET Poisson-Schrodinger equation inverse piezoelectronic polarization effect (IPPE) j recessed source and drain j current collapse
  • 相关文献

参考文献11

  • 1KHAN M A, BHATTARAI A, KUZNIA J N, et al. High electron mobility transistor based on a GaN-A1GaN heterojunction [ J]. Appl Phys Lett, 1993, 63 (9) : 1214-1215.
  • 2张志国,冯震,杨梦丽,冯志红,默江辉,蔡树军,杨克武.凹栅AlGaN/GaN HFET[J].Journal of Semiconductors,2007,28(9):1420-1423. 被引量:4
  • 3THERRIEN R, SINGHAL S, JOHNSON J W, et al. A 36 mm GaN-on-Si HEMT producing 368 W at 60 V with 70% drain efficiency [ J]. IEEE: IEDM Technical Di- gest, 2005, 5/6/7: 568-571.
  • 4WU Y F, KELLER B P, KELLER S, et al. Measured microwave power performance of A1GaN/GaN MODFET [J]. IEEE Electron Device Lett, 1996, 17 (9): 455- 457.
  • 5CHINI A, COFFIE R, MENEGHESSON G, et al. 2. 1 A/mm current density AIGaN/GaN HEMT [ J ]. Electron Lett, 2003, 39 (7): 625-626.
  • 6WU Y F, SAXLER A, MOORE M, et al. 30 W/mm GaN HEMTs by field plate optimization [J]. IEEE Elec- tron Device Letter, 2004, 25 (3): 117-119.
  • 7MITTEREDER J A, BINARI S C, KLEIN P B, et al. Current collapse induced in A1GaN/GaN high-electron- mobility transistors by bias stress [ J ]. Applied Physics Letters, 2003, 83 (8): 1650-1652.
  • 8KOHN E, DAUMILLER I, SCHMID P, et al. Large signal frequency dispersion of A1GaN/GaN heterostrueture field effect transistors [ J ]. Electronics Letters, 1999, 35 (12): 1022-1023.
  • 9AMBACHER O, FOUTZ B, SMART J, et al. Two di- mensional electron gases induced by spontaneous and pie- zoelectric polarization in undoped and doped A1GaN/GaN heterostructures [ J ]. J Appl Phys, 2000, 85 (6): 3222-3233.
  • 10李若凡,杨瑞霞,武一宾,张志国,许娜颖,马永强.用逆压电极化模型对AlGaN/GaN高电子迁移率晶体管电流崩塌现象的研究[J].物理学报,2008,57(4):2450-2455. 被引量:5

二级参考文献23

  • 1孔月婵,郑有炓,周春红,邓永桢,顾书林,沈波,张荣,韩平,江若琏,施毅.AlGaN/GaN异质结构中极化与势垒层掺杂对二维电子气的影响[J].物理学报,2004,53(7):2320-2324. 被引量:12
  • 2张志国,杨瑞霞,王勇,冯震,杨克武.跨导为325mS/mm的AlGaN/GaNHFET器件[J].Journal of Semiconductors,2005,26(9):1789-1792. 被引量:2
  • 3张志国,杨瑞霞,李丽,冯震,王勇,杨克武.蓝宝石衬底AlGaN/GaN HFET功率特性[J].Journal of Semiconductors,2006,27(7):1255-1258. 被引量:2
  • 4Khan M A,Bhattarai A,Kuznia J N,et al.High electron mobility transistor based on a GaN-AlGaN heterojunction.Appl Phys Lett,1993,63(9):1214.
  • 5Wu Y F,Keller B P,Keller S,et al.Measured microwave power performance of AlGaN/GaN MODFET.IEEE Electron Device Lett,1996,17(9):455.
  • 6Maekawa A,Yamamoto T,Mitani E,et al.A 500W push-pull AlGaN/GaN HEMT amplifier for L-band high power application.IEEE MTT-S,2006:722.
  • 7Chen Tangsheng,Jiao Gang,Li Zhonghui,et al.AlGaN/GaN MIS HEMT with AlN dielectric.CS MANTECH Conference,2006:227.
  • 8Khan M A,Bhattarai A,Kuznia J N,et al.High electron mobility transistor based on a GaN-AIGaN heterojunction.Appl Phys Lett,1993,63(9):1214.
  • 9Wu Y F,Saxler A,Moore M,et al.30W/mm GaN HEMTs by field plate optimization.IEEE Electron Device Lett,2004,25(3):117.
  • 10Therrien R,Singhal S,Johnson J W,et al.A 36mm GaN-onSi HEMT producing 368W at 60V with 70%drain efficiency.International Electron Devices Meeting,2005:285.

共引文献10

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部