粗磨粒金刚石砂轮精密磨削工程陶瓷的试验研究

Experimental research on the precision grinding of advanced ceramics using coarse diamond grinding wheel

为了实现粗磨粒金刚石砂轮延性域磨削加工SiC陶瓷材料，采用碟轮对粒径为297-420μm的粗磨粒金刚石砂轮进行了精密修整。然后，使用经过修整好的粗磨粒金刚石砂轮对SiC陶瓷进行磨削加工。在此基础上，对不同的砂轮线速度、工件进给速度、磨削切深对SiC陶瓷表面粗糙度和表面形貌的影响进行了研究。试验结果表明：经过精密修整的粗磨粒金刚石砂轮是能够实现SiC陶瓷材料的延性域磨削的，表面粗糙度值Ra达到0．151μm；随着砂轮线速度增大、工件进给速度和磨削切深减小，SiC陶瓷表面的脆性断裂减小，塑性去除增加。

In order to achieve the ductile regime grinding of SiC ceramics, the dressing experiments of coarse diamond grinding wheel with 297 - 420 μm grain size are conducted with plate wheel. Then, the wellconditioned coarse diamond grinding wheel is applied to grind SiC ceramics. The effect of different grinding parameters on surface roughness and ground surface morphology of the SiC ceramics is studied under high speed grinding conditions. The experimental results indicate that the well-conditioned coarse diamond wheel is able to realize ductile regime grinding of SiC ceramics, and the ground surface roughness is 0. 151 μm. Moreover, the increase in wheel speed as well as the decrease in feed rate and cutting depth can result in a decrease in fragile mode and an increase in plastic removal mode.