摘要
孔内无铜是带盲孔的高密度互连线路板失效的最常见问题之一。针对假正片电镀工艺中盲孔板出现孔内无铜的原因进行分析,并给出了相应的控制措施、注意事项等,为同行业的技术人员改善此类问题提供一定的参考。
No copper in hole is one of the most common problems for failures of high density interconnect circuit boards with blind holes.The causes for no copper in hole of PCB with blind holes in false positive plating process are analyzed and corresponding control measures,cautions,etc.are also given,which can provide a certain reference for the technicians in this industry to solve such a problem.
出处
《电镀与环保》
CAS
CSCD
北大核心
2014年第2期11-13,共3页
Electroplating & Pollution Control
基金
高端高阶HDI电路板关键技术的研究与应用(No.2013389022)
关键词
印制线路板
盲孔
孔内无铜
图形电镀
蚀刻
树脂塞孔
PCB
blind hole
no copper in hole
pattern plating
etching
resin plugging hole
