模块冷板作用及组装流程浅析

Analysis about the Action of the Module Cold Plate and Its Assembly Process

冷板为电子器件提供散热通路,器件封装形式改变导致器件散热需求发生变化,冷板由器件底部粘接薄板改为器件顶部盖板。文中介绍了两种冷板的结构特点,分析当前冷板设计的问题及解决办法,表贴器件为主的模块采用薄板冷板带来很多组装难点,应改为散热盖板形式冷板,为新型电子模块冷板设计及组装提供借鉴。

The heat dissipation requirements of device changed because of its packaging type alteration which lead to the cold plate which supply heat dissipation pathway for electronic device changed from bottom adhesive-sheet to top cover-plate. The structure features of two types cold plate were introduced. The design problems and solving methods of current cold plate were analyzed. Sheet cold plate of module which primarily adopt with surface mounted device should be changed into cold plate with heat dissipation cover-plate because of its assembly difficulties which provide reference for cold plate design and assembly of new type electronic modules.