摘要
研究了BGA焊点在受到热循环冲击与跌落冲击综合作用下的可靠性,研究了基于不同热循环冲击条件下的电子产品的板级跌落寿命、失效机理与失效模式、断裂行为与Kirkendall空洞的关系。结果表明,有铅焊点比无铅焊点可靠性略高,弹性模量低的BGA与PCB制造材料耐热不耐跌落冲击,并提出了改善电子产品可靠性的办法。
Reliability of ball grid array（BGA） solder joint was studied in comprehensive action of dropping and thermal cycle tests. The board-level drop lifetimes of electronic products, failure mechanism and failure mode, the connection between fracture behaving and Kirkendall voids were studied in different thermal cycles. Results show that the reliability of lead solder joints is higher than lead-free solder joints, BGA with low elastic modulus and PCB manufacturing materials tolerance heat but intolerance drop impact. Ways to improve the reliability of electronic products are proposed.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第4期67-70,共4页
Electronic Components And Materials
基金
南京信息职业技术学院科研基金资助项目(No.YKJ12-016)
