摘要
论述了高频信号在PCB中传输时,介质对于传输线损耗的影响。以此为基础,提出传输线介质参数校准流程,完成传输线测试板的设计,通过对测试板的仿真、测试,推导得出PCB介质的介电常数与损耗因子,提高高频传输线的仿真精度,同时验证了此流程方法的有效性。
The impact of PCB dielectrics on transmission line when the high-frequency signal travels through the PCB is described and discussed. Furthermore, a new PCB dielectrics parameters calibration process is proposed. It collects the design data by simulation and validation based on PCB test board, then it gets the Dk and Dt using this new proposed process. The test results demonstrate that such process is effective and can improve the model accuracy of transmission line.
出处
《计算机工程与科学》
CSCD
北大核心
2014年第3期416-419,共4页
Computer Engineering & Science
基金
国家863计划资助项目(2011AA01A201)
高效能服务器和存储技术国家重点实验室课题资助项目
关键词
PCB
传输线
介电常数
损耗因子
printed circuit board
transmission line
dielectric constant
dissipation factor