无菌熔接片加热升温过程的数值模拟分析

Numerical Simulation of the Electrical-heating Process of the Sterile Fusing Blade

本文针对无菌熔接片的加热升温过程进行数值模拟分析,具体考察了熔接片基片材质、所施加电压以及电阻线电导率等三个参数对其加热升温过程的影响结果表明,在所考察的镍、铜和不锈钢三种基片中铜为综合性能较好的材料:此外,所施加电压与电阻线的电导率对熔接片的升温加热过程也有明显影响。本文的研究结果能为无菌熔接片的优化设计提供一定的指导作用,进而促进开放式医用导管无菌熔接技术与装备的发展。

In this paper , the numerical simulation of the electrical-heating process of the sterile fusing blade was carried out . Specifically , the effects of the base material , imposed voltage , and the electrical conductivity of the line resistor were investigated . The simulation results showed that copper is the most suitable material for the base of the sterile fusing blade within the scope of the investigated materials . Furthermore , the effects of the imposed voltage and the electrical conductivity of the line resistor were also found remarkable . The findings in this work provide useful information for optimization design of the sterile fusing blade , and hence facilitate the development of the technology and equipment of the sterile fusing connection for medical tubes .