共面微波探针在片测试技术研究

On-Wafer Measurement Techniques Using Coplanar Microwave Probe

本文描述了使用共面微波探针的半导体芯片在片测试技术 .设计研制出的多种微波探针性能参数稳定 ,使用寿命在十万次以上 ,用于在片检测各种GaAs共面集成电路芯片 .触头排列为GSG的微波探针 ,- 3dB带宽及反射损耗分别为 14GHz和小于 - 10dB .

We present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes. The probe parameters are repeatable enough for S-parameter measurements and the probe life is with 100,000 contacts guaranteed. The multi-contact microwave wafer probe is developed for on-wafer testing and sifting of GaAs integrated circuits with coplanar type. The insertion loss of microwave probe with a GSG footprint pattern is typically less than 3.0 dB, and the return loss is at least 10 dB at frequencies below 14 GHz.