高频板制作关键技术探讨

Control of key points of high frequency board

高频板涉及的技术相对较高,相关制作、检测设备和技术人员都是企业在跨越的一道难题,所以应充分考虑市场和技术、设备能力等方面的因素尤为重要。通讯基站应用的高频板市场方面,在中国及另一些发展中国家市场需求相对旺盛,值得关注。文章重点介绍高频板内层-压合层间控制和钻孔-电镀孔粗控制两个方式制作关键点,以供参考和建议。

High frequency PCB involved relatively high technology, because of the production, testing equipment and technical personnel are high. So a company should fully consider the factors of market and technology, equipment and other aspects. High frequency board market is mainly in communication base station applications in China and some other developing countries. The market demand is relatively strong, worthy of attention. This paper focuses on high-frequency boards - compression layer control and drilling - two ways to control the key points of coarse plating hole, so as to provide reference and suggestions.