摘要
在公司制程能力为70μm/70μm的工艺条件下,运用半加成法探索进行线宽为30μm的挠性双面板精细线路制作工艺研究。通过正交试验法的L9(34)正交表设计对精细线路制作中的显影速度、显影压力、蚀刻速度、蚀刻压力四个因素进行工艺优化,确定了线宽为30μm的挠性双面板精细线路制作的最佳条件。结果表明,显影速度为主要影响因素。
The company has a processing capacity for 70μm/70μm lines, by using semi-additive processing we had explored how to produce the flexible double-sided 30μm fine lines. By designing a L9（34） orthogonal table test, we had a four factors process optimization on developing speed, developing pressure, etching speed and etching pressure to determine the optimum production conditions for 30μm ifne lines. According to the result, developing speed is the main factors.
出处
《印制电路信息》
2014年第3期36-39,共4页
Printed Circuit Information
关键词
半加成法
精细线路
正交试验法
工艺优化
Semi-Additive Processing
Fine Lines
Orthogonal Test
Process Optimization
