PCB盲孔填孔电镀中光泽剂及工艺条件的影响研究

Study of the effect of the additives and processing conditions in PCB blind hole filling

采用自制电镀设备研究光亮剂、整平剂及润湿剂在盲孔电镀中的作用机理,以及喷压、电流密度、阴阳极距离等工艺条件对填孔率的影响。实验结果表明,各添加剂在氯离子的协同作用下对填孔起着至关重要的作用。适宜的喷压有助于将药水带进盲孔内,电流密度及其组合对电镀填孔影响较大,阴阳极距离保持在5cm左右填孔效果最佳。

Studying the mechanism of b, Leveler, wetter in blind hole plating processing by using the self making equipment, and the effect of spray pressure, current density, distance between the anode and cathode on the iflling rate. The experimental results showed that the additives play a vital role in the blind hole iflling process with the synergistic effect of chloride ions. Suitable spray pressure helps the additives into the blind hole, current densities and it’s combinations have great impact on blind hole iflling, 5cm between anode and cathode is best for iflling.