改善阻焊溢油方法研究

Discussing the prevention method of ink overflowed of sold mask

从分析"阻焊塞孔"在制造过程中产生"阻焊溢油"不良原因,及不同GERBER图形设计条件下使用不同的CAM工具入手,在采用专用的"塞孔油墨"的基础上,探讨通过优化"阻焊照片"、"塞孔铝片"为主,"树脂塞孔"工艺替代和"分段固化"为辅,达到预防和降低"阻焊溢油"不良的目的,从而提高PCB产品可靠性。

This paper discusses how to improve product reliability by beginning with the analysis bad reasons of ink spill over after solder mask during the resistance welding hole manufacturing process. Then it talks about using different CAM tools on GERBER graphic design under different conditions. On the basis of the use a special ink, it discusses the optimization solder mask iflm, based on Aluminum sheet stuff hole, Plugging resin replacement process and segment curing supplement, to prevent and reduce the ink spill over after solder mask , in order to improve the reliability of PCB products.