摘要
根据多例沉锡焊接失效案例,对导致沉锡PCB焊接失效的原因进行了分析,并详细的介绍了多种沉锡PCB焊接失效分析方法。
Based on many cases of immersion tin soldering failure cases, the soldering failures causes were analyzed, and a variety of immersion tin PCB soldering failure analysis methods were introduced in detail.
出处
《印制电路信息》
2014年第3期62-66,共5页
Printed Circuit Information
关键词
沉锡
电路板
可焊性
失效分析方法
Immersion Tin
PCB
Solderability
Failure Analysis Methods
