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集成电路中接口电路的可靠性设计 被引量:4

Design of I/O Circuit Reliability in IC
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摘要 在集成电路设计中,可将承担静电放电保护、电平转换、电路驱动等功能的电路组合成接口电路,通过对接口电路的可靠性设计来提高集成电路的可靠性。从电路设计、版图设计、封装设计等设计阶段的特点出发,阐述了各阶段可靠性设计的内容,并总结了一些设计要点和设计准则,提出了可采用接口电路、封装、PCB三者协同设计的方法,以提高接口电路的可靠性。 In ICs design, undertaking ESD protect, level shift, circuit drive etc. the function’s circuit constitute an I/O circuit. With Reliability design of I/O circuit increase IC’s reliability. Characteristics that the paper design from the circuit designing, layout designing, and package designing etc. the stage set out. Reliability each stage contents that design, summarize some design important points and design rules. Bring upped the adoption I/O circuit, seal to pack, PCB in conjunction with the design’s method, increasing I/O circuit reliability.
出处 《电子与封装》 2014年第3期41-45,共5页 Electronics & Packaging
关键词 集成电路 接口电路 可靠性 IC I/O circuit reliability
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参考文献1

  • 1王志功.集成电路设计[M].北京:电子工业出版社,2009.

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同被引文献32

  • 1廖庆敏.高校实验室安全管理之思考[J].实验室研究与探索,2010,29(1):168-170. 被引量:228
  • 2周英才,杨光伦,马振球.关于提高硬件电路设计质量和可靠性的一点思考[J].铁路通信信号工程技术,2013,10(S1):115-118. 被引量:1
  • 3刘明君,禹申,黄金.电路可靠性设计的探讨[J].煤矿机械,2006,27(11):18-20. 被引量:1
  • 4Baozhen L, Christiansen C, Badami D, et al. Electromigration Challenges for Advanced on-chip CuInterconnects[J]. Microelectronics Reliability, 2014, 54(4): 712-724.
  • 5Lall P, Lowe R, Goebel K. Comparison of prognostic health management algorithms for assessment of electronic interconnect reliability[C]. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Burlingame, CA, United states, July 16 - July 18, 2013. A019-A029.
  • 6Ramakrishnan Arun, Pecht Michael G. A Life Consumption Monitoring Methodology for Electronic Systems[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(3): 625-634.
  • 7刘建影.微电子技术的可靠性--互连、器件及系统[M].北京:科学出版社,2013.36-45.
  • 83GPP TR 36.912.Feasibility Study for Further Advancements for E-UTRA ( LTE-Advanced ) [ Z ]. 09,2009:8-15.
  • 9ITU-R WP 5DI580-E. Submission of TD-LTE-Advanced for IMT- Advanced Candidate Technology [ Z 1. I 0,2009.
  • 10FTDI Chip. FT4232H Datasheet Version 2.10[Z]. 2010.

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