摘要
A strained-SiGe p-channel metal-oxide-semiconductor-field-effect transistors （p-MOSFETS） with higher-k LaLu03 gate dielectric was fabricated and electrically characterized. The novel higher-k （k-30） gate dielectric, LaLuO3, was deposited by molecular-beam deposition and shows good quality for integration into the transistor. The transistor features good output and transfer characteristics. The hole mobility was extracted by the splitting C-V method and a value of 2OOcm2/V.s was obtained for strong inversion conditions, which indicates that the hole mobility is well enhanced by SiGe channel and that the LaLuO3 layer does not induce additional significant carrier scattering. Gate induced drain leakage is measured and analyzed by using an analytical model. Band-to- band tunneling et^ciencies under high and low fields are found to be different, and the tunneling mechanism is discussed.
A strained-SiGe p-channel metal-oxide-semiconductor-field-effect transistors （p-MOSFETS） with higher-k LaLu03 gate dielectric was fabricated and electrically characterized. The novel higher-k （k-30） gate dielectric, LaLuO3, was deposited by molecular-beam deposition and shows good quality for integration into the transistor. The transistor features good output and transfer characteristics. The hole mobility was extracted by the splitting C-V method and a value of 2OOcm2/V.s was obtained for strong inversion conditions, which indicates that the hole mobility is well enhanced by SiGe channel and that the LaLuO3 layer does not induce additional significant carrier scattering. Gate induced drain leakage is measured and analyzed by using an analytical model. Band-to- band tunneling et^ciencies under high and low fields are found to be different, and the tunneling mechanism is discussed.
基金
Supported by the Science and Technology Commission of Shanghai Municipality under Grant Nos 12ZR1453000, 12ZR1453100 and 12ZR1436300, the National Natural Science Foundation of China under Grant Nos 61306126, 61306127 and 61106015, and the CAS International Collaboration and Innovation Program on High Mobility Materials Engineering.
