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Low-leakage-current AlGaN/GaN HEMTs on Si substrates with partially Mg-doped GaN buffer layer by metal organic chemical vapor deposition 被引量:1

Low-leakage-current AlGaN/GaN HEMTs on Si substrates with partially Mg-doped GaN buffer layer by metal organic chemical vapor deposition
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摘要 High-performance low-leakage-current A1GaN/GaN high electron mobility transistors (HEMTs) on silicon (111) sub- strates grown by metal organic chemical vapor deposition (MOCVD) with a novel partially Magnesium (Mg)-doped GaN buffer scheme have been fabricated successfully. The growth and DC results were compared between Mg-doped GaN buffer layer and a unintentionally onμe. A 1μ m gate-length transistor with Mg-doped buffer layer exhibited an OFF-state drain leakage current of 8.3 × 10-8 A/mm, to our best knowledge, which is the lowest value reported for MOCVD-grown A1GaN/GaN HEMTs on Si featuring the same dimension and structure. The RF characteristics of 0.25-μ m gate length T-shaped gate HEMTs were also investigated. High-performance low-leakage-current A1GaN/GaN high electron mobility transistors (HEMTs) on silicon (111) sub- strates grown by metal organic chemical vapor deposition (MOCVD) with a novel partially Magnesium (Mg)-doped GaN buffer scheme have been fabricated successfully. The growth and DC results were compared between Mg-doped GaN buffer layer and a unintentionally onμe. A 1μ m gate-length transistor with Mg-doped buffer layer exhibited an OFF-state drain leakage current of 8.3 × 10-8 A/mm, to our best knowledge, which is the lowest value reported for MOCVD-grown A1GaN/GaN HEMTs on Si featuring the same dimension and structure. The RF characteristics of 0.25-μ m gate length T-shaped gate HEMTs were also investigated.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第3期597-601,共5页 中国物理B(英文版)
关键词 AlGaN/GaN HEMTs low-leakage current metal organic chemical vapor deposition Mg-dopedbuffer layer AlGaN/GaN HEMTs, low-leakage current, metal organic chemical vapor deposition, Mg-dopedbuffer layer
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  • 1Uemoto Y,Shibata D,Yanagihara M,Ishida H,Matsuo H,Nagai S,Batta N,Li M,Ueda T,Tanaka T and Ueda D 2007 IEDM Tech.Digest.861.
  • 2Wu Y F,Saxler A,Moore M,Smith R P,Sheppard S,Chavarkar P M,Wisleder T,Mishra U K and Parikh P 2004 IEEE Electron Device Lett.25 117.
  • 3Vertiatchikh A V and Eastman L F 2003 IEEE Electron Device Lett.24 535.
  • 4Shi L,Feng S W,Guo C S,Zhu H and Wan N 2013 Chin.Phys.B 22 027201.
  • 5Meneghesso G,Verzellesi G,Danesin F,Rampazzo F,Zanon F,Tazzoli A,Meneghini M and Zanoni E 2008 IEEE Trans.Device Mater.Rel.8 332.
  • 6Nariaki I,Jiang L,Kazuo K,Shuusuke K,Kazama T,Kokawa T,Sato Y,Iwami M,Nomura T and Masuda M 2008 High-Density Multi-Fiber Connectors for Optical Interconnection,Furukawa Review 34 17.
  • 7Young C C,Ho Y C,Boris P,Michael G S and Lester F E 2006 IEEE Electron Device Lett.53 2926.
  • 8Choi Y,Shi J,Pophristic M,Spencer M and Eastman L 2007 J.Vac.Sci.Technol.A 25 1836.
  • 9Cordiera Y,Azizea M,Barona N,Bougrioua Z,Chenot S,Tottereau O,Massies J and Gibart P 2008 J.Cryst.Growth 310 948.
  • 10Pan C J and Chi G C 1999 Solid State Electron.43 621.

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