有限元分析薄膜/基底在纳米压痕过程中的力学性能

Finite Element Analysis on the Mechanical Properties of the Film/Substrate System in the Process of Nanoindentation

运用有限元程序ABAQUS/Standard,建立了纳米压痕的有限元模型,并对一般薄膜/基底体系进行了数值模拟。结果表明:在压入相同深度时,薄膜的厚度越大,卸载后的残余深度越浅。薄膜的厚度越大,基底对薄膜的影响越小。对于同一厚度薄膜在不同最大压痕深度时,残余深度和基底的内应力会随着最大压痕深度的增加而增大。最后,采用前面论述的薄膜/基底体系,利用有限元方法模拟不同弹性模量对纳米压痕的影响,并将模拟结果和实验结果进行了对比。

The finite-element code ABAQUS/Standard was applied to establish the finite element model of nanoindentation and the film/substrate system was simulated. The numerical simulation results indicate that the residual depth after unloading become shallow as the film thickness increasing, while the indentation depths are the same. The influence of substrate become small as the film thickness increasing. For the film with the same thickness, the residual depth and the internal stress of substrate increase with the increase of the maximum indentation depth. At last, the finite-element method （FEM） is applied to simulate the effect of different Young＇s modulus on the nanoindentation, and the FEM results are compared with the experiment data.