期刊文献+

10 Gbit/s 850 nm pin光电二极管

10 Gbit/s 850 nm pin Photoelectric Diode
下载PDF
导出
摘要 GaAs pin光电二极管在数据通信领域发挥着重要的作用,在综合考虑了高速光电探测器的频率特性和响应度的基础上,给出了AlGaAs/GaAs pin光电二极管结构参数的最优化设计,使其在频率响应特性上满足10 Gbit/s的要求。着重研究了在半导体制作工艺中所涉及的光刻、腐蚀、表面钝化以及欧姆接触等问题,研制出暗电流小、响应速率高、响应度高而且可靠性良好的短波长高速pin光电二极管。在产品应用之前的可靠性测试中,老化时间大于2 000 h的情况下仍能保持良好的暗电流特性,满足工业化生产的条件。 GaAs pin photodetector plays an important role in high-speed data communication field. In consideration of the frequency characteristic of the high-speed photodetector and the responsibility, the A1GaAs/GaAs pin photodiode structural parameters optimization design was given, satisfying the demand of 10 Gbit/s on the frequency response. In the semiconductor production process, the problems such as the lithography, corrosion, surface passivation and ohmic contact were studied. The short wavelength high-speed pin photoelectric diode was developed which had good performances, such as the low dark current, high response speed, high responsibility and good reliability. In the product reliability testing before the application, the pin diode had the good performance of the dark current while the aging time was more than 2 000 h. The results show that the industrial production conditions are satisfied.
出处 《半导体技术》 CAS CSCD 北大核心 2014年第4期285-288,共4页 Semiconductor Technology
关键词 850 nm波段 数据通信 PIN光电二极管 A1GaAs GAAS 半导体工艺 850 nm wavelength data communication pin photoelectric diode A1GaAs/GaAs semiconductor process
  • 相关文献

参考文献5

二级参考文献14

  • 1傅珂,马志强,李雪松,张锐.40Gb/s,100Gb/s以太网IEEE P802.3ba标准研究[J].光通信技术,2009,33(11):12-15. 被引量:8
  • 2黄永清,任晓敏,黄辉,王兴妍,李轶群,王琦.特殊图案透明欧姆接触微结构提高谐振腔增强型光探测器的响应性能[J].中国激光,2006,33(5):617-620. 被引量:1
  • 3王文娟,王兴妍,黄辉,崔海林,苗昂,李轶群,任晓敏,黄永清.新型长波长可调谐光电探测器[J].光电子.激光,2006,17(11):1283-1286. 被引量:7
  • 4Madureiru M A A, Monteiro P M P, Aguiar R L, et al. Broad-band transimpedance amplifier for multigi- gabit-per-second (40 Gbps) optical communication systems in 0. 135 μm PHEMT technology [C]. Proc IEEE ISCSA, 2003,1 : 409-412.
  • 5Miyamoto Y, Yoneyama M, Imai Y, et al. 40 Gbitps optical receiver module using a flip-chip bonding technique for device intereonneetion[J]. Electronics Letters, 1998,34(5) :493-494.
  • 6Bach H G, Beling A, Mekonnen G G, et al. Design and fabrication of 60-Gb/s InP-based monolithic photoreceiver OEICs and modules [J]. IEEE J Selected Topics in Quantum Electronics, 2002,8(6):1 445- 1 450.
  • 7Zhang Y, Whelan C S, Leoni R, et al. 40-Gbit/s OEIC on GaAs substrate through metamorphic buffer technology[J]. IEEE Electron Device Lett, 2003,24 (9):529-531.
  • 8John D ' AMBROSIA. 4 0 Gigabit Ethernet and 1 0 0 Gigabit Ethernet: The Development of A Flexible ar- chitecture [J]. IEEE Commun Mag, 2009,47 (3) : 8- 14.
  • 9IEEE 802.3ba-2011, 40 Gb/s and 100 Gb/s Ethernet Task Force [S].
  • 10SHAFALFarhad. 40Gandl 0 0 GEthernet [ EB/ OL]. http..//www, bladenetwork, net/userfiles/file/ PDFs/WP_40G_, 2009-06-18.

共引文献18

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部